small outline package

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• small-outline package — mažų matmenų korpusas statusas T sritis radioelektronika atitikmenys: angl. low profile package; small outline package vok. Kleinbauendgehäuse, n rus. малогабаритный корпус, m pranc. boîtier de petites dimensions, m; petit boîtier, m …   Radioelektronikos terminų žodynas

• small-outline package integrated circuit — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… …   Radioelektronikos terminų žodynas

• Thin small-outline package — Thin small outline packages, or TSOPs are a type of surface mount IC package. They are notably very low profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs dues to their high pin… …   Wikipedia

• Shrink Small-Outline Package — (SSOP) is a microchip package for surface mount technology. SSOP chips have gull wing leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).ee also*Plastic Small Outline Package (PSOP) *Thin Small Outline Package… …   Wikipedia

• Small-outline integrated circuit — A small outline integrated circuit (SOIC) is a surface mounted integrated circuit (IC) package which occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same… …   Wikipedia

• small-outline transistor package — tranzistorinis mažų matmenų korpusas statusas T sritis radioelektronika atitikmenys: angl. small outline transistor package vok. Kleinbauendtransistorgehäuse, n rus. малогабаритный корпус транзисторного типа, m pranc. boîtier de petites… …   Radioelektronikos terminų žodynas

• Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

• Dual in-line package — ICs in DIP Gehäusen Einfache DIP Fassungen …   Deutsch Wikipedia

• Quad Flat Package — 44 poliges QFP (ein Mikroprozessor Z80) Quad Flat Package (QFP) bezeichnet in der Elektronik eine weit verbreitete Gehäusebauform für Integrierte Schaltungen. Die Anschlüsse (Pins) befinden sich an den vier Seiten des flachen Gehäuses. QFP werden …   Deutsch Wikipedia

• low-profile package — mažų matmenų korpusas statusas T sritis radioelektronika atitikmenys: angl. low profile package; small outline package vok. Kleinbauendgehäuse, n rus. малогабаритный корпус, m pranc. boîtier de petites dimensions, m; petit boîtier, m …   Radioelektronikos terminų žodynas

• Outline of chess — A game of chess, in the starting position. See also: Glossary of chess and Index of chess articles The following outline is provided as an overview of and topical guide to chess: Chess – two player board game played on a chessboard, a square …   Wikipedia